StarTech Heatsink Accessories

Thermal Paste, High Performance Thermal Paste, Re-sealable Syringe (1.5g), Metal Oxide Heat Sink Compound, CPU/GPU Thermal Grease Paste, RoHS / CE

Re-sealable Syringe | Thermal Conductivity: 1.93 W/m-K at 25 °C or greater






 



This thermal paste works with a heat sink to improve heat dissipation from integrated circuits (ICs), like CPUs, GPUs and other computer chips. The thermal paste features CE and RoHS certifications so you can rest assured it's safe for its intended use.


Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.




High-Performance Thermal Paste The thermal paste, also known as silver grease, is a metal based (metal oxide) compound that contains 50% silicone, 30% carbon and 20% metal oxide to offer better thermal conductivity than standard heat transfer pastes with negligible electrical conductivity. The thermal paste/glue is suitable for operation in temperatures of -22°F to 365°F (-30°C to 180°C) with thermal conductivity of 3.07 W/m-K at 25 °C or greater. This performance makes the compound ideal for servicing & maintaining workstations, desktop computers and servers.




Conveniently Sized 1.5g Tubes The tube contains 1.5g of paste, sufficient for 4 to 6 applications. the compound is packaged in a syringe for easy application, that's re-sealable to prevent the product from drying between use. SILVGREASE1 is backed by a StarTech.com 2-year warranty, including free lifetime 24/5 multi-lingual, North American based, technical assistance.





Applications: Service and maintain workstations, desktop computers and servers
Replace old or dried out thermal paste
High demand applications, such as overclocking and high performance CPUs









Features: THERMAL PASTE: Metal oxide based compound works with a heat sink to improve heat dissipation from CPUs & other integrated computer chips; Offers better thermal conductivity than standard heat transfer pastes with negligible electrical conductivity
HIGH-PERFORMANCE THERMAL CONDUCTIVITY: Suitable for operation in the temperatures of -22F to 365F (-30C to 180C) this compound has thermal conductivity of 3.07 W/m-K at 25 C or greater; Ideal for servicing & maintaining workstations or desktop CPUs/GPUs
CONVENIENT SIZE: The tube contains 1.5g of paste sufficient for 4-6 applications, in a re-sealable syringe that prevents drying between use
CERTIFIED: This thermal paste features CE and RoHs certifications so you can rest assured it's safe for its intended use; The compound contains 50% silicone, 30% carbon and 20% metal oxide
THE IT Pro's Choice: Designed and built for IT Professionals, this tube of silver grease/glue is backed for 2-years, including free lifetime 24/5 multi-lingual technical assistance









The StarTech.com Advantage: Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications









Features Thermal resistance 0.12 °C/W Thermal conductivity 1.93 W/m·K Operating temperature (T-T) -30 - 180 °C Product colour Silver Specific gravity 1.7 g/cm³

Technical details Evaporation (@ 200°C/24h) 0.001% Bleed (@ 200°C/24h) 0.05% Sustainability certificates RoHS Thermal resistance 0.12 °C/W Thermal conductivity 1.93 W/m·K Operating temperature (T-T) -30 - 180 °C

Weight & dimensions Package width 84 mm Package height 25 mm Package depth 151 mm Package weight 17 g Weight 10 g Depth 67 mm Full specification and details can be found in the

Heatsink Thermal Pads - Pack of 5

Improves heat transfer between a Microcontroller/chipset and heatsink with easy-to-use thermal pads







 




This 5 pack of Thermal Pads offers a suitable alternative to using heatsink paste/grease. The thermal pads remain solid at room temperature, and soften at heatsink operating temperatures - eliminating the mess of heat grease, while maximizing heat conduction to create a cooler operating environment for your hard working microcontrollers or chipset components.





Applications: Replaces traditional heatsink grease









Features: Low thermal impedance
Electrically non-conductive
Solid at room temperature, it softens at heatsink operating temperatures
Conforms to surface irregularities









The StarTech.com Advantage: Easy "peel and stick" installation ensures an even application each time
Mess free










Features Product colour Grey

Weight & dimensions Package width 90 mm Package height 2 mm Package depth 125 mm Package weight 8 g Full specification and details can be found in the

20g Tube CPU Thermal Paste Grease Compound for Heatsinks

Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound







 




The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.


This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.


Please see our support section for the Material Safety Data Sheet for HEATGREASE20.





Applications: Replace old or dried out thermal paste to replenish heat dispersion between a CPU and heatsink
System builders who put together many low-end to mainstream systems









Features: Ceramic-based compound containing silicone
Thermal conductivity of more than 1.066 W/m-K









The StarTech.com Advantage: Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler
Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer
Ceramic-based compound that is electrically non-conductive, for safe use around electronics










Features Storage temperature (T-T) -50 - 100 °C Operating relative humidity (H-H) 10 - 80% Thermal resistance 0.195 °C/W Thermal conductivity 1.066 W/m·K Operating temperature (T-T) -20 - 100 °C Product colour White Specific gravity 2.3 g/cm³

Technical details Evaporation (@ 200°C/24h) 0.001 % Bleed (@ 200°C/24h) 0.005 % Sustainability certificates RoHS Storage temperature (T-T) -50 - 100 °C Operating relative humidity (H-H) 10 - 80% Thermal resistance 0.195 °C/W Thermal conductivity 1.066 W/m·K Operating temperature (T-T) -20 - 100 °C

Weight & dimensions Width 72 mm Height 18 mm Depth 18 mm Weight 24 g

Operational conditions Storage temperature (T-T) -50 - 100 °C Operating temperature (T-T) -20 - 100 °C Full specification and details can be found in the