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20g Tube CPU Thermal Paste Grease Compound for Heatsinks
Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.
This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.
Please see our support section for the Material Safety Data Sheet for HEATGREASE20.
Features | |
Storage temperature (T-T) | -50 - 100 °C |
Operating relative humidity (H-H) | 10 - 80% |
Thermal resistance | 0.195 °C/W |
Thermal conductivity | 1.066 W/m·K |
Operating temperature (T-T) | -20 - 100 °C |
Product colour | White |
Specific gravity | 2.3 g/cm³ |
Technical details | |
Evaporation (@ 200°C/24h) | 0.001 % |
Bleed (@ 200°C/24h) | 0.005 % |
Sustainability certificates | RoHS |
Storage temperature (T-T) | -50 - 100 °C |
Operating relative humidity (H-H) | 10 - 80% |
Thermal resistance | 0.195 °C/W |
Thermal conductivity | 1.066 W/m·K |
Operating temperature (T-T) | -20 - 100 °C |
Weight & dimensions | |
Width | 72 mm |
Height | 18 mm |
Depth | 18 mm |
Weight | 24 g |
Operational conditions | |
Storage temperature (T-T) | -50 - 100 °C |
Operating temperature (T-T) | -20 - 100 °C |
Full specification and details can be found in the PDF file
20g Tube CPU Thermal Paste Grease Compound for Heatsinks
Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound
The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.
This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.
Please see our support section for the Material Safety Data Sheet for HEATGREASE20.
Features | |
Storage temperature (T-T) | -50 - 100 °C |
Operating relative humidity (H-H) | 10 - 80% |
Thermal resistance | 0.195 °C/W |
Thermal conductivity | 1.066 W/m·K |
Operating temperature (T-T) | -20 - 100 °C |
Product colour | White |
Specific gravity | 2.3 g/cm³ |
Technical details | |
Evaporation (@ 200°C/24h) | 0.001 % |
Bleed (@ 200°C/24h) | 0.005 % |
Sustainability certificates | RoHS |
Storage temperature (T-T) | -50 - 100 °C |
Operating relative humidity (H-H) | 10 - 80% |
Thermal resistance | 0.195 °C/W |
Thermal conductivity | 1.066 W/m·K |
Operating temperature (T-T) | -20 - 100 °C |
Weight & dimensions | |
Width | 72 mm |
Height | 18 mm |
Depth | 18 mm |
Weight | 24 g |
Operational conditions | |
Storage temperature (T-T) | -50 - 100 °C |
Operating temperature (T-T) | -20 - 100 °C |
Full specification and details can be found in the PDF file