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Analog signal processing firm Quellan has unveiled a range of media interconnect chips which could enable the production of high bandwidth ultra-thin cabling.
Showcased at the Consumer Electronics Show 2009 in Las Vegas, the chips allow for the replacement of standard interconnects with thick copper cabling.
"Quellan's technology is a major breakthrough at a time when thin copper interconnects are becoming extremely critical in the consumer market," said Ken Fleck of Fleck Research.
He added that the new technology will result in the production of thinner and longer copper cabling.
The chips, which are embedded in the cables connectors, reduce the effects of skew, attenuation, group delay and crosstalk, allowing for a reduction in diameter that does not adversely affect bandwidth.
Quellan claims that the demand for thin cabling is increasing as more and more portable devices demand data transfer rates capable of handling high definition signals.
Meanwhile, copper prices reached their highest value in a month yesterday, according to Reuters.
Last Updated: 08/01/2009 16:05
Quellan unveils ultra-thin cabling solution - Article Discussion
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